Hot Melt, as a add-on, is designed to be compatible with various VERMES systems and to extend their capabilities.
Engineered for precision, speed, and durability, it is ideally suited for the rigorous demands of semiconductor, electronics, automotive, and other advanced manufacturing sectors.
- Seamless integration: Easy to retrofit onto the existing valve system for hot melt adhesive dispensing.
- High-temperature capability: Ideal for adhesives that require high temperatures (up to 230 °C).
- Improved media cost efficiency: Reduced adhesive waste, less downtime, longer media life.
- High throughput: Delivers consistent, accurate dots at high speed.
- Reliable performance under stress: Designs for thermal stability, material compatibility, and low maintenance.
