Hot melt is a thermoplastic adhesive that changes its solid state to liquid when passing through the zones of increasing temperature. Hot melt applications are getting more and more popular in electronic industry, e.g., for bonding smartphone displays.
| Heating components | 2 separate heating channels (Cartridge, Hose / Fluid Box Body) |
| Power | 145 W (Cartridge 100 W; Nozzle heating 45 W); 40 W Valve |
| Max. temperature (Hot Melt) | 230 °C (achieved through heater controller) |
| Frequency | ~ 500 Hz continuous frequency, max. 700 Hz |
| Technology | Powered by DST Technology |
| Actuator pressure | 1.5 – 8 bar |
| Cartridge pressure | 0.1 – 10 bar (rel.) |
| Dimension (Hot Melt + Valve + Fluid Box) | 160 mm H x 46 mm W x 153 mm D |
| Weight (Hot Melt + Valve + Fluid Box) | 1,100 g |
| Power connection | MDV 1560: 24 V DC / 4 A Hot melt: 48 V DC / 4 A |
